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| PulseGuard (R) Suppressors Surface Mount Polymeric ESD Suppressors RoHS Pb PGB1 Series Lead-Free 0805 ESD Suppressor Product Overview PulseGuard ESD Suppressors help protect sensitive electronic equipment against electrostatic discharge (ESD). They supplement the on-chip protection of integrated circuitry and are best suited for lowvoltage, high-speed applications where low capacitance is important. Data ports utilizing such high-speed protocols as USB 2.0, IEEE1394, HDMI and DVI can benefit from this new technology. PulseGuard suppressors use polymer composite materials to suppress fast-rising ESD transients (as specified in IEC 61000-4-2 and MIL-STD-883E), while adding virtually no capacitance to the circuit. Features * Lead-Free * Ultra-low capacitance * Low leakage current * Fast response time * 4-lines of protection * Bi-directional * Withstands multiple ESD strikes * Based on industry standard 2012 package * Compatible with pick-and-place processes * Available in 1,000 and 5,000 piece reels (EIA-RS481) Reference Dimensions: Reflow Solder 0.71 (.028") 1.27 (.050") 2.03 (.080") TYP Typical Applications * * * * * * HDTV Hardware Laptop/Desktop Computers Network Hardware Computer Peripherals Digital Cameras External Storage 0.635 (.025") 0.74 (.029") 1.27 (.050") TYP 0.51 (.020") 0.279 (.011") Sn 0.203 (.008") TYP 0.127 (.005") TYP 0.74 (.029") * Set-Top Boxes NOTE: When wave soldering, the gap between pads should be covered with photo-imageable solder mask to prevent bridging between terminations under the component. Also the spacing between the ground contacts should be increased from .635mm (.025") to .889 (.035"). 0.406 (.016") TYP Ordering Information CATALOG NUMBER PGB1040805MR PGB1040805NR PIECES PER REEL 1,000 5,000 2 5 Equivalent Circuit 1 6 Design Consideration Because of the fast rise-time of the ESD transient, placement of PulseGuard suppressors is a key design consideration. To achieve optimal ESD suppression, the devices should be placed on the circuit board as close to the source of the ESD transient as possible. Install PulseGuard suppressors directly behind the connector so that they are the first board-level circuit component encountered by the ESD transient. They are connected from signal/data line to ground. 3 4 206 w w w. l i t t e l f u s e . c o m PulseGuard (R) Suppressors Surface Mount Polymeric ESD Suppressors RoHS Pb PGB1 Series Lead-Free 0805 ESD Suppressor Capacitance vs. Frequency 70 ** Note: 1,000 fF = 1 pF Electrical Characteristics ESD Capability IEC 61000-4-2 Direct Discharge ....................................................8kV IEC 61000-4-2 Air Discharge .......................................................15kV Trigger Voltage1 .....................................................................500 V, typical Clamping Voltage1 ..................................................................150V, typical Rated Voltage ........................................................................24VDC, max Capacitance2 ................................................................................0.055 pF Response Time ................................................................................< 1ns Leakage Current3 .............................................................................< 1nA ESD Pulse Withstand4 ..........................................1,000 pulses, minimum 1 Capacitance (fF) 60 50 40 0.5 1.0 1.5 2.0 4 Frequency (GHz) PULSEGUARD(R) SUPPRESSORS + + Notes: 1. Trigger and clamping voltage measured per IEC 61000-4-2, 8kV direct discharge method. 2. Capacitance measured at 1MHZ. 3. Leakage current measured at 6VDC. 4. Pulse Withstand- some shifting in characteristics may occur when tested over multiple pulses at a very rapid rate. Carrier Tape Specifications Parts are delivered on 7" (178mm) reel, paper carrier tape Environmental Specifications Operating Temperature: -65C to +125C. Moisture Resistance, steady state: MIL-STD-833, method 1004.7, 85% RH, 85C, 1000hrs. Thermal Shock: MIL-STD-202, Method 107G, -65C to 125C, 30 min cycle, 10 cycles. Vibration: MIL-STD-202F, Method 201A, (10 to 55 to 10Hz, 1 min. cycle, 2grs each in X-Y-Z) Chemical Resistance: ASTM D-543, 4hrs @ 40C, 3 solutions (H2O, detergent solution, defluxer) Solder leach resistance and terminal adhesion: Per EIA-576 test Tt Dd + + Ds Tw Pd + + + Ph Pw Ct Ps Physical Specifications Materials: Body: Glass Epoxy Terminations: 100% Copper/Nickel/Tin Solderability: MIL-STD-202, Method 208 (95% coverage) DESCRIPTION Ct - Cover tape thickness Dd - Drive hole diameter Ds - Drive hole spacing Pd - Pocket depth Ph - Pocket height Ps - Pocket spacing Pw - Pocket width Tt - Carrier tape thickness Tw - Carrier tape width MEASUREMENT (MM) 0.06 1.50 4.00 0.58 2.21 4.00 1.45 0.65 8.00 Soldering Parameters: Wave Solder - 260C, 10 seconds maximum. Reflow Solder - 260C, 30 seconds maximum. Packaging Specifications 8mm Tape and Reel per EIA-RS481-1 (IEC 286, part3); 1,000 pieces per reel, add packaging suffix, MR; 5,000 per reel, add packaging suffix NR. w w w. l i t t e l f u s e . c o m 207 |
Price & Availability of PGB1040805MR
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